Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11787097 | Conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processes | Nishant Lakhera, Boon Yew Low | 2023-10-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11787097 | Conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processes | Nishant Lakhera, Boon Yew Low | 2023-10-17 |