Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11581241 | Circuit modules with front-side interposer terminals and through-module thermal dissipation structures | Boon Yew Low, Fernando A. Santos, Li Li, Fui Yee Lim | 2023-02-14 |