Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842957 | Amplifier modules and systems with ground terminals adjacent to power amplifier die | Jeffrey K. Jones, Kevin Kim, Ibrahim Khalil | 2023-12-12 |
| 11621228 | Substrate with thermal vias and sinter-bonded thermal dissipation structure | Lu Li, Lakshminarayan Viswanathan | 2023-04-04 |