Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749639 | Die-substrate assemblies having sinter-bonded backside via structures and associated fabrication methods | Lakshminarayan Viswanathan | 2023-09-05 |
| 11616040 | Semiconductor dies having ultra-thin wafer backmetal systems, microelectronic devices containing the same, and associated fabrication methods | Tianwei Sun | 2023-03-28 |