Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11733035 | Feed-forward of multi-layer and multi-process information using XPS and XRF technologies | Heath A. Pois, Wei Ti Lee, Lawrence V. Bot, Michael Kwan, Charles Thomas Larson | 2023-08-22 |
| 11668663 | Method and system for non-destructive metrology of thin layers | Wei Ti Lee, Heath A. Pois, Cornel Bozdog | 2023-06-06 |