Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11668663 | Method and system for non-destructive metrology of thin layers | Wei Ti Lee, Heath A. Pois, Mark Klare | 2023-06-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11668663 | Method and system for non-destructive metrology of thin layers | Wei Ti Lee, Heath A. Pois, Mark Klare | 2023-06-06 |