Issued Patents 2023
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11843009 | Photosensitive assembly, imaging module, smart terminal, and method and mould for manufacturing photosensitive assembly | Takehiko Tanaka, Zhewen Mei | 2023-12-12 |
| 11824071 | Camera module and molded photosensitive assembly and manufacturing method thereof, and electronic device | Mingzhu Wang, Nan Guo, Bojie Zhao, Takehiko Tanaka, Zhen Huang +2 more | 2023-11-21 |
| 11822099 | Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Nan Guo, Heng Jiang +4 more | 2023-11-21 |
| 11785325 | Camera module having circuit board, molded base, and optical lens, electronic device having same and method for manufacturing camera module | Mingzhu Wang, Bojie Zhao, Zhewen Mei, Nan Guo, Lifeng YAO | 2023-10-10 |
| 11758253 | Camera module having chamfer, photosensitive assembly, preparation method, and electronic device | Bojie Zhao, Dongli YUAN, Zhen Huang, Qimin Mei | 2023-09-12 |
| 11733477 | Optical actuator, and corresponding camera module and camera module array | Yinli FANG, Hongde Tu, Jianlong Zhang | 2023-08-22 |
| 11728368 | Semiconductor packaging method and semiconductor device based on molding process | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Heng Jiang, Nan Guo | 2023-08-15 |
| 11729483 | Photosensitive component, and camera module and manufacturing method therefor | Mingzhu Wang, Zhongyu Luan, Zhen Huang, Nan Guo, Fengsheng Xi +5 more | 2023-08-15 |
| 11721709 | Circuit board assembly with photosensitive element mounted to back side of circuit board | Mingzhu Wang, Nan Guo, Takehiko Tanaka, Jingfei He, Zhen Huang +2 more | 2023-08-08 |
| 11691132 | Modified Y-type molecular sieve, catalytic cracking catalyst comprising the same, their preparation and application thereof | Lingping Zhou, Qiuqiao Jiang, Shuai Yuan, Hao Sha, Mingde Xu +2 more | 2023-07-04 |
| 11653079 | Camera module, circuit board assembly and manufacturing method thereof, and electronic device with camera module | Mingzhu Wang, Nan Guo, Bojie Zhao, Takehiko Tanaka, Feifan Chen +1 more | 2023-05-16 |
| 11652132 | Systems and methods for manufacturing semiconductor modules | Mingzhu Wang, Nan Guo, Jingfei He, Bojie Zhao, Takehiko Tanaka +4 more | 2023-05-16 |
| 11640012 | Virtual high-density well survey | Zhengxin Zhang, Wei Chen, Yuelin Shen | 2023-05-02 |
| 11627239 | Photosensitive assembly and camera module and manufacturing method thereof | Mingzhu Wang, Takehiko Tanaka, Zhongyu Luan, Bojie Zhao, Zhen Huang +4 more | 2023-04-11 |
| 11601576 | Array camera module having height difference, circuit board assembly and manufacturing method therefor, and electronic device | Mingzhu Wang, Takehiko Tanaka, Nan Guo, Bojie Zhao, Zhewen Mei | 2023-03-07 |
| 11579341 | Lens, camera module and manufacturing method thereof | Mingzhu Wang, Bojie Zhao, Chunmei Liu, Feifan Chen | 2023-02-14 |
| 11575844 | Multi-aperture imaging system and application thereof | Yinli FANG, Mingzhu Wang, Lifeng YAO, Ang Ji, Yurong Wu | 2023-02-07 |
| 11575816 | Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof | Mingzhu Wang, Nan Guo, Takehiko Tanaka, Bojie Zhao, Zilong Deng | 2023-02-07 |
| 11548814 | Glass with reinforced layer and preparation method thereof | Wei Hu, Fanghua Chen | 2023-01-10 |
| 11541377 | Modified Y-type molecular sieve, catalytic cracking catalyst comprising the same, their preparation and application thereof | Hao Sha, Lingping Zhou, Shuai Yuan, Weilin Zhang, Mingde Xu +1 more | 2023-01-03 |