Issued Patents 2023
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11835784 | Adjustable optical lens and camera module and aligning method thereof | Mingzhu Wang, Liang Ding, Chunmei Liu, Feifan Chen, Nan Guo | 2023-12-05 |
| 11824071 | Camera module and molded photosensitive assembly and manufacturing method thereof, and electronic device | Mingzhu Wang, Zhenyu Chen, Nan Guo, Takehiko Tanaka, Zhen Huang +2 more | 2023-11-21 |
| 11822099 | Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device | Mingzhu Wang, Takehiko Tanaka, Nan Guo, Zhenyu Chen, Heng Jiang +4 more | 2023-11-21 |
| 11785325 | Camera module having circuit board, molded base, and optical lens, electronic device having same and method for manufacturing camera module | Mingzhu Wang, Zhewen Mei, Nan Guo, Lifeng YAO, Zhenyu Chen | 2023-10-10 |
| 11758253 | Camera module having chamfer, photosensitive assembly, preparation method, and electronic device | Dongli YUAN, Zhen Huang, Qimin Mei, Zhenyu Chen | 2023-09-12 |
| 11758255 | Camera module and manufacturing method thereof | Zhen Huang, Qimin Mei, Zhewen Mei, Li-Wei Liu, Jiawei Chen +2 more | 2023-09-12 |
| 11745401 | Molded circuit board of camera module, manufacturing equipment and manufacturing method for molded circuit board | Mingzhu Wang, Takehiko Tanaka, Zhen Huang | 2023-09-05 |
| 11743569 | Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof | Mingzhu Wang, Takehiko Tanaka, Feifan Chen, Qimin Mei, Liang Ding +1 more | 2023-08-29 |
| 11729483 | Photosensitive component, and camera module and manufacturing method therefor | Mingzhu Wang, Zhenyu Chen, Zhongyu Luan, Zhen Huang, Nan Guo +5 more | 2023-08-15 |
| 11728368 | Semiconductor packaging method and semiconductor device based on molding process | Mingzhu Wang, Takehiko Tanaka, Zhenyu Chen, Heng Jiang, Nan Guo | 2023-08-15 |
| 11706514 | Camera module and molded photosensitive assembly and manufacturing methods thereof, and electronic device | Zhen Huang, Qimin Mei, Zhewen Mei, Li-Wei Liu, Jiawei Chen +1 more | 2023-07-18 |
| 11706516 | Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof | Mingzhu Wang, Takehiko Tanaka, Feifan Chen, Qimin Mei, Liang Ding +1 more | 2023-07-18 |
| 11664397 | Camera module, photosensitive component, photosensitive-component joined panel, and forming die thereof and manufacturing method thereof | Takehiko Tanaka, Zhewen Mei, Nan Guo | 2023-05-30 |
| 11659263 | Split lens and camera module and electronic apparatus | Mingzhu Wang, Shoujie WANG, Nan Guo, Liang Ding, Feifan Chen +2 more | 2023-05-23 |
| 11653079 | Camera module, circuit board assembly and manufacturing method thereof, and electronic device with camera module | Mingzhu Wang, Nan Guo, Zhenyu Chen, Takehiko Tanaka, Feifan Chen +1 more | 2023-05-16 |
| 11652132 | Systems and methods for manufacturing semiconductor modules | Mingzhu Wang, Nan Guo, Jingfei He, Zhenyu Chen, Takehiko Tanaka +4 more | 2023-05-16 |
| 11646332 | Photosensitive assembly, photographing module, and photosensitive assembly jointed board and corresponding manufacturing method thereof | Takehiko Tanaka, Ye Wu, Zhewen Mei, Mingzhu Wang | 2023-05-09 |
| 11627384 | Multi-lens camera module conjoined stand, multi-lens camera module and application thereof | Kouwen ZHANG, Keqiang Xiong, Mingzhu Wang | 2023-04-11 |
| 11627239 | Photosensitive assembly and camera module and manufacturing method thereof | Mingzhu Wang, Zhenyu Chen, Takehiko Tanaka, Zhongyu Luan, Zhen Huang +4 more | 2023-04-11 |
| 11601576 | Array camera module having height difference, circuit board assembly and manufacturing method therefor, and electronic device | Mingzhu Wang, Takehiko Tanaka, Zhenyu Chen, Nan Guo, Zhewen Mei | 2023-03-07 |
| 11579341 | Lens, camera module and manufacturing method thereof | Mingzhu Wang, Chunmei Liu, Feifan Chen, Zhenyu Chen | 2023-02-14 |
| 11575816 | Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof | Mingzhu Wang, Zhenyu Chen, Nan Guo, Takehiko Tanaka, Zilong Deng | 2023-02-07 |
| 11570336 | System-level camera module with electrical support and manufacturing method thereof | Mingzhu Wang, Feifan Chen, Liang Ding, Nan Guo, Ye Wu +1 more | 2023-01-31 |