Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11822099 | Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Nan Guo, Zhenyu Chen +4 more | 2023-11-21 |
| 11824071 | Camera module and molded photosensitive assembly and manufacturing method thereof, and electronic device | Mingzhu Wang, Zhenyu Chen, Nan Guo, Bojie Zhao, Takehiko Tanaka +2 more | 2023-11-21 |
| 11729483 | Photosensitive component, and camera module and manufacturing method therefor | Mingzhu Wang, Zhenyu Chen, Zhen Huang, Nan Guo, Fengsheng Xi +5 more | 2023-08-15 |
| 11721709 | Circuit board assembly with photosensitive element mounted to back side of circuit board | Mingzhu Wang, Nan Guo, Zhenyu Chen, Takehiko Tanaka, Jingfei He +2 more | 2023-08-08 |
| 11652132 | Systems and methods for manufacturing semiconductor modules | Mingzhu Wang, Nan Guo, Jingfei He, Zhenyu Chen, Bojie Zhao +4 more | 2023-05-16 |
| 11627239 | Photosensitive assembly and camera module and manufacturing method thereof | Mingzhu Wang, Zhenyu Chen, Takehiko Tanaka, Bojie Zhao, Zhen Huang +4 more | 2023-04-11 |