Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11843009 | Photosensitive assembly, imaging module, smart terminal, and method and mould for manufacturing photosensitive assembly | Takehiko Tanaka, Zhenyu Chen | 2023-12-12 |
| 11785325 | Camera module having circuit board, molded base, and optical lens, electronic device having same and method for manufacturing camera module | Mingzhu Wang, Bojie Zhao, Nan Guo, Lifeng YAO, Zhenyu Chen | 2023-10-10 |
| 11758255 | Camera module and manufacturing method thereof | Zhen Huang, Qimin Mei, Bojie Zhao, Li-Wei Liu, Jiawei Chen +2 more | 2023-09-12 |
| 11706514 | Camera module and molded photosensitive assembly and manufacturing methods thereof, and electronic device | Zhen Huang, Qimin Mei, Bojie Zhao, Li-Wei Liu, Jiawei Chen +1 more | 2023-07-18 |
| 11664397 | Camera module, photosensitive component, photosensitive-component joined panel, and forming die thereof and manufacturing method thereof | Takehiko Tanaka, Bojie Zhao, Nan Guo | 2023-05-30 |
| 11646332 | Photosensitive assembly, photographing module, and photosensitive assembly jointed board and corresponding manufacturing method thereof | Takehiko Tanaka, Bojie Zhao, Ye Wu, Mingzhu Wang | 2023-05-09 |
| 11601576 | Array camera module having height difference, circuit board assembly and manufacturing method therefor, and electronic device | Mingzhu Wang, Takehiko Tanaka, Zhenyu Chen, Nan Guo, Bojie Zhao | 2023-03-07 |