Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11834415 | Adhesive composition for semiconductor circuit connection and adhesive film including the same | Ju Hyeon KIM, Junghak Kim, SeungHee NAM | 2023-12-05 |
| 11760907 | Adhesive resin composition for semiconductor, adhesive film for semiconductor device using the same and dicing die bonding film using the same | Jong Min Jang, Yu Sun | 2023-09-19 |
| 11702520 | Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the same | Minsu Jeong, You-Jin Kyung, Byung Ju Choi, Woo Jae Jeong, Eunbyurl CHO | 2023-07-18 |
| 11702571 | Adhesive sheet for temporary fixation and method of manufacturing semiconductor device using the same | Sera Kim, Ji Ho HAN | 2023-07-18 |