Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11760907 | Adhesive resin composition for semiconductor, adhesive film for semiconductor device using the same and dicing die bonding film using the same | Jong Min Jang, Kwang Joo Lee | 2023-09-19 |