Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11811434 | Device and method for transmitting and receiving emulated Wi-Fi packets | Song Min KIM, Jin Hwan Jung, Seok Won Yang, Yung Yi | 2023-11-07 |
| 11702520 | Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the same | Minsu Jeong, You-Jin Kyung, Byung Ju Choi, Kwang Joo Lee, Eunbyurl CHO | 2023-07-18 |