Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11702520 | Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the same | Minsu Jeong, Byung Ju Choi, Woo Jae Jeong, Kwang Joo Lee, Eunbyurl CHO | 2023-07-18 |