Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784141 | Semiconductor package having thin substrate and method of making the same | Jun Lu, Long Wang, Madhur Bobde, Bo-Wei Chen | 2023-10-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784141 | Semiconductor package having thin substrate and method of making the same | Jun Lu, Long Wang, Madhur Bobde, Bo-Wei Chen | 2023-10-10 |