Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784141 | Semiconductor package having thin substrate and method of making the same | Jun Lu, Long Wang, Madhur Bobde, Shuhua Zhou | 2023-10-10 |
| 11721665 | Wafer level chip scale semiconductor package | Yan Xun Xue, Madhur Bobde, Long Wang | 2023-08-08 |
| 11669634 | Privacy-preserving predicting method and electrical device | — | 2023-06-06 |