Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784141 | Semiconductor package having thin substrate and method of making the same | Jun Lu, Long Wang, Bo-Wei Chen, Shuhua Zhou | 2023-10-10 |
| 11776994 | SiC MOSFET with reduced channel length and high Vth | David Sheridan, Arash Salemi | 2023-10-03 |
| 11756993 | IGBT light load efficiency | Lingpeng Guan, Karthik Padmanabhan, Bum Seok Suh | 2023-09-12 |
| 11749716 | Semiconductor device incorporating epitaxial layer field stop zone | Lei Zhang, Karthik Padmanabhan, Lingpeng Guan, Jian Wang, Lingbing Chen +3 more | 2023-09-05 |
| 11721665 | Wafer level chip scale semiconductor package | Yan Xun Xue, Long Wang, Bo-Wei Chen | 2023-08-08 |
| 11699627 | DMOS FET chip scale package and method of making the same | Yan Xun Xue, Long Wang, Hongyong Xue, Zhiqiang Niu, Jun Lu | 2023-07-11 |
| 11594613 | Sawtooh electric field drift region structure for planar and trench power semiconductor devices | Lingpeng Guan, Anup Bhalla, Hamza Yilmaz | 2023-02-28 |