Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784141 | Semiconductor package having thin substrate and method of making the same | Long Wang, Madhur Bobde, Bo-Wei Chen, Shuhua Zhou | 2023-10-10 |
| 11699627 | DMOS FET chip scale package and method of making the same | Yan Xun Xue, Long Wang, Hongyong Xue, Madhur Bobde, Zhiqiang Niu | 2023-07-11 |