| 11830799 |
Semiconductor device package, antenna device, and method for manufacturing the same |
Bernd Karl Appelt |
2023-11-28 |
| 11830798 |
Semiconductor device package |
Bernd Karl Appelt |
2023-11-28 |
| 11791281 |
Package substrate and method for manufacturing the same |
Pao-Hung Chou, Chun-Hsien Yu |
2023-10-17 |
| 11791245 |
Electronic package and method for manufacturing the same |
Bernd Karl Appelt, Kay Stefan Essig |
2023-10-17 |
| 11735433 |
Substrate structure, package structure and method for manufacturing electronic package structure |
Bernd Karl Appelt |
2023-08-22 |
| 11705401 |
Semiconductor package structure and method for manufacturing the same |
Bernd Karl Appelt, Kay Stefan Essig |
2023-07-18 |
| 11682656 |
Semiconductor device package and method for manufacturing the same |
Bernd Karl Appelt, Kay Stefan Essig |
2023-06-20 |
| 11664301 |
Semiconductor device package |
Bernd Karl Appelt |
2023-05-30 |
| 11664339 |
Package structure and method for manufacturing the same |
Bernd Karl Appelt |
2023-05-30 |
| 11631633 |
Substrate structure, semiconductor package structure and method for manufacturing semiconductor package structure |
Kuang-Hsiung Chen, Bernd Karl Appelt |
2023-04-18 |
| 11616007 |
Electronic package |
Bernd Karl Appelt, Kay Stephan Essig |
2023-03-28 |
| 11610834 |
Leadframe including conductive pillar over land of conductive layer |
Bernd Karl Appelt |
2023-03-21 |
| 11574856 |
Semiconductor package |
Bernd Karl Appelt, Kay Stefan Essig |
2023-02-07 |
| 11545406 |
Substrate structure, semiconductor package structure and method for manufacturing a substrate structure |
Bernd Karl Appelt, Kay Stefan Essig |
2023-01-03 |