Issued Patents 2023
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830798 | Semiconductor device package | You-Lung Yen | 2023-11-28 |
| 11830799 | Semiconductor device package, antenna device, and method for manufacturing the same | You-Lung Yen | 2023-11-28 |
| 11791245 | Electronic package and method for manufacturing the same | You-Lung Yen, Kay Stefan Essig | 2023-10-17 |
| 11735433 | Substrate structure, package structure and method for manufacturing electronic package structure | You-Lung Yen | 2023-08-22 |
| 11705401 | Semiconductor package structure and method for manufacturing the same | You-Lung Yen, Kay Stefan Essig | 2023-07-18 |
| 11682656 | Semiconductor device package and method for manufacturing the same | You-Lung Yen, Kay Stefan Essig | 2023-06-20 |
| 11664339 | Package structure and method for manufacturing the same | You-Lung Yen | 2023-05-30 |
| 11664301 | Semiconductor device package | You-Lung Yen | 2023-05-30 |
| 11631633 | Substrate structure, semiconductor package structure and method for manufacturing semiconductor package structure | You-Lung Yen, Kuang-Hsiung Chen | 2023-04-18 |
| 11616007 | Electronic package | You-Lung Yen, Kay Stephan Essig | 2023-03-28 |
| 11610834 | Leadframe including conductive pillar over land of conductive layer | You-Lung Yen | 2023-03-21 |
| 11574856 | Semiconductor package | You-Lung Yen, Kay Stefan Essig | 2023-02-07 |
| 11545406 | Substrate structure, semiconductor package structure and method for manufacturing a substrate structure | You-Lung Yen, Kay Stefan Essig | 2023-01-03 |