Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791245 | Electronic package and method for manufacturing the same | You-Lung Yen, Bernd Karl Appelt | 2023-10-17 |
| 11705401 | Semiconductor package structure and method for manufacturing the same | You-Lung Yen, Bernd Karl Appelt | 2023-07-18 |
| 11682656 | Semiconductor device package and method for manufacturing the same | You-Lung Yen, Bernd Karl Appelt | 2023-06-20 |
| 11574856 | Semiconductor package | Bernd Karl Appelt, You-Lung Yen | 2023-02-07 |
| 11545406 | Substrate structure, semiconductor package structure and method for manufacturing a substrate structure | You-Lung Yen, Bernd Karl Appelt | 2023-01-03 |