Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854930 | Semiconductor chip package and fabrication method thereof | Yi-Lin Tsai, I-Hsuan Peng, Wen-Sung Hsu | 2023-12-26 |
| 11830820 | Electronic package with rotated semiconductor die | Yao-Chun Su, Chih-Jung Hsu, I-Hsuan Peng | 2023-11-28 |
| 11830851 | Semiconductor package structure | Yi-Lin Tsai, Wen-Sung Hsu, I-Hsuan Peng | 2023-11-28 |
| 11728232 | Semiconductor package having a stiffener ring | Chi-Wen Pan, I-Hsuan Peng, Sheng-Liang Kuo, Tai-Yu Chen | 2023-08-15 |
| 11670596 | Semiconductor package structure | Yi-Lin Tsai, Wen-Sung Hsu, I-Hsuan Peng | 2023-06-06 |
| 11646295 | Semiconductor package structure having an annular frame with truncated corners | Chia-Cheng Chang, Tzu-Hung Lin, I-Hsuan Peng | 2023-05-09 |