Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791282 | Semiconductor package including part of underfill on portion of a molding material surrounding sides of logic chip and memory stack on interposer and method for manufacturing the same | Jaekyung Yoo, Jayeon LEE, Jaeeun Lee, Teakhoon Lee | 2023-10-17 |
| 11721669 | Semiconductor package including a first semiconductor stack and a second semiconductor stack of different widths | Junyeong Heo, Jae Eun Lee, Donghoon Won | 2023-08-08 |
| 11694963 | Semiconductor device and semiconductor package including the same | Jaeeun Lee, Junyeong Heo | 2023-07-04 |
| 11610828 | Semiconductor package and method of manufacture | Jinwoo Park, Jongho Lee | 2023-03-21 |
| 11594499 | Semiconductor package | Un-Byoung Kang, Jaekyung Yoo, Teak-Hoon Lee | 2023-02-28 |