WB

William E. Bernier

IBM: 1 patents #2,552 of 6,852Top 40%
📍 Endwell, NY: #4 of 11 inventorsTop 40%
🗺 New York: #4,092 of 11,993 inventorsTop 35%
Overall (2023): #208,890 of 537,848Top 40%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11810893 Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protection Bing Dang, John U. Knickerbocker, Son K. Tran, Mario J. Interrante 2023-11-07