Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776877 | Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths | Xiao Li, Steven K. Groothuis, Jian Li, Jaspreet S. Gandhi, James M. Derderian +1 more | 2023-10-03 |
| 11735549 | Methods and systems for manufacturing pillar structures on semiconductor devices | Suresh Yeruva, Owen R. Fay, Adriel Jebin Jacob Jebaraj, Wayne H. Huang | 2023-08-22 |
| 11728293 | Chip modules employing conductive pillars to couple a passive component device to conductive traces in a metallization structure to form a passive component | Changhan Hobie Yun, Daniel Daeik Kim, Paragkumar Ajaybhai Thadesar, Nosun PARK | 2023-08-15 |
| 11658403 | Device, package and/or substrate comprising curved antenna | Changhan Hobie Yun, Daniel Daeik Kim, Paragkumar Ajaybhai Thadesar, Nosun PARK | 2023-05-23 |
| 11631630 | Pillar-last methods for forming semiconductor devices | Anilkumar Chandolu, Wayne H. Huang | 2023-04-18 |