Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784151 | Redistribution layer connection | Aniket PATIL, Hong Bok We | 2023-10-10 |
| 11682607 | Package having a substrate comprising surface interconnects aligned with a surface of the substrate | Hong Bok We, Aniket PATIL | 2023-06-20 |
| 11552023 | Passive component embedded in an embedded trace substrate (ETS) | Kuiwon Kang, Brigham NAVAJA, Terence Cheung | 2023-01-10 |