Issued Patents 2023
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855039 | Chip package structure | Jung-Hua Chang, Cheng-Lin Huang | 2023-12-26 |
| 11848302 | Chip package structure with ring-like structure | Sheng-Yao Yang, Yu-Jui Wu, Cheng-Lin Huang, Chien-Chen Li, Lieh-Chuan Chen +2 more | 2023-12-19 |
| 11840034 | Method of fabricating molds for forming eyepieces with integrated spacers | Mauro Melli, Chieh Chang, Melanie Maputol West, Christophe Peroz, Ali Karbasi +2 more | 2023-12-12 |
| 11790968 | Spintronic device, SOT-MRAM storage cell, storage array and in-memory computing circuit | Guozhong Xing, Huai Lin, Cheng Lu, Qi Liu, Hangbing Lv +1 more | 2023-10-17 |
| 11784091 | Structure and formation method of chip package with fan-out feature | Jung-Hua Chang, Cheng-Lin Huang | 2023-10-10 |
| 11740469 | Eyepiece for head-mounted display and method for making the same | Chieh Chang, Christophe Peroz, Ryan Jason Ong, Sharad D. Bhagat, Samarth Bhargava | 2023-08-29 |
| 11726317 | Waveguides having integral spacers and related systems and methods | Ali Karbasi, Christophe Peroz, Chieh Chang, Sharad D. Bhagat, Brian George Hill +5 more | 2023-08-15 |
| 11656480 | Methods and systems for augmented reality display with dynamic field of view | Chieh Chang, Victor Kai Liu, Samarth Bhargava, Sharad D. Bhagat, Christophe Peroz +1 more | 2023-05-23 |
| 11630256 | Customized polymer/glass diffractive waveguide stacks for augmented reality/mixed reality applications | Sharad D. Bhagat, Brian George Hill, Christophe Peroz, Chieh Chang | 2023-04-18 |
| 11569159 | Structure and formation method of chip package with through vias | Jung-Hua Chang, Cheng-Lin Huang | 2023-01-31 |
| 11545463 | Chip package structure with ring-like structure | Sheng-Yao Yang, Yu-Jui Wu, Cheng-Lin Huang, Chien-Chen Li, Lieh-Chuan Chen +2 more | 2023-01-03 |