Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776619 | Techniques to couple high bandwidth memory device on silicon substrate and package substrate | James A. McCall, Shigeki Tomishima, George Vergis, Kuljit S. Bains | 2023-10-03 |
| 11621237 | Interposer and electronic package | Jonathan W. Thibado, Jeffory L. Smalley, John C. Gulick, Phi Thanh, Mohanraj Prabhugoud | 2023-04-04 |
| 11569161 | Integrated memory coplanar transmission line package having ground path that brackets data path to extend memory speeds | James A. McCall, Michael Gutzmann | 2023-01-31 |
| 11557333 | Techniques to couple high bandwidth memory device on silicon substrate and package substrate | James A. McCall, Shigeki Tomishima, George Vergis, Kuljit S. Bains | 2023-01-17 |