Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837314 | Undo and redo of soft post package repair | Bill Nale, Wei-Pin Chen, Rajat Agarwal | 2023-12-05 |
| 11776619 | Techniques to couple high bandwidth memory device on silicon substrate and package substrate | Chong J. Zhao, James A. McCall, Shigeki Tomishima, George Vergis | 2023-10-03 |
| 11704194 | Memory wordline isolation for improvement in reliability, availability, and scalability (RAS) | — | 2023-07-18 |
| 11650765 | Apparatus and method for performing persistent write operations using a persistent write command | Raj K. Ramanujan, Liyong Wang, Wesley Queen | 2023-05-16 |
| 11557333 | Techniques to couple high bandwidth memory device on silicon substrate and package substrate | Chong J. Zhao, James A. McCall, Shigeki Tomishima, George Vergis | 2023-01-17 |