Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776619 | Techniques to couple high bandwidth memory device on silicon substrate and package substrate | Chong J. Zhao, Shigeki Tomishima, George Vergis, Kuljit S. Bains | 2023-10-03 |
| 11657862 | Electrically coupled trace routing configuration in multiple layers | Rogelio Alfonso Moreyra Gonzalez, Jose Angel Ramos Martinez | 2023-05-23 |
| 11569161 | Integrated memory coplanar transmission line package having ground path that brackets data path to extend memory speeds | Chong J. Zhao, Michael Gutzmann | 2023-01-31 |
| 11557333 | Techniques to couple high bandwidth memory device on silicon substrate and package substrate | Chong J. Zhao, Shigeki Tomishima, George Vergis, Kuljit S. Bains | 2023-01-17 |