Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842943 | Electronic systems with inverted circuit board with heat sink to chassis attachment | Barrett M. Faneuf, Phil Geng, Kenan Arik, David Shia, Casey Winkel +9 more | 2023-12-12 |
| 11683890 | Reflow grid array to support late attach of components | Jonathan W. Thibado, John C. Gulick, Phi Thanh, Mohanraj Prabhugoud | 2023-06-20 |
| 11621237 | Interposer and electronic package | Jonathan W. Thibado, John C. Gulick, Phi Thanh, Mohanraj Prabhugoud, Chong J. Zhao | 2023-04-04 |
| 11545408 | Reflowable grid array to support grid heating | Jonathan W. Thibado, John C. Gulick, Phi Thanh | 2023-01-03 |