Issued Patents 2023
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824010 | Interposers for microelectronic devices | Owen R. Fay | 2023-11-21 |
| 11791315 | Semiconductor assemblies including thermal circuits and methods of manufacturing the same | Owen R. Fay, Eiichi Nakano | 2023-10-17 |
| 11789890 | Memory devices, modules and systems having memory devices with varying physical dimensions, memory formats, and operational capabilities | Thomas H. Kinsley, George E. Pax, Timothy M. Hollis, Yogesh Sharma, Randon K. Richards +2 more | 2023-10-17 |
| 11784166 | Dual sided fan-out package having low warpage across all temperatures | Mark E. Tuttle | 2023-10-10 |
| 11728307 | Semiconductor interconnect structures with conductive elements, and associated systems and methods | Shams U. Arifeen, Quang Nguyen, Christopher Glancey, Koustav Sinha | 2023-08-15 |
| 11721742 | Memory modules and memory packages including graphene layers for thermal management | George E. Pax, Yogesh Sharma, Gregory A. King, Thomas H. Kinsley, Randon K. Richards | 2023-08-08 |
| 11688658 | Semiconductor device | Hyunsuk Chun, Shams U. Arifeen, Tracy N. Tennant | 2023-06-27 |
| 11664291 | Semiconductor assemblies including vertically integrated circuits and methods of manufacturing the same | Owen R. Fay | 2023-05-30 |
| 11589480 | Tubular heat spreaders for memory modules and memory modules incorporating the same | Thomas H. Kinsley, George E. Pax, Yogesh Sharma, Gregory A. King, Randon K. Richards | 2023-02-21 |
| 11581231 | Stress tuned stiffeners for micro electronics package warpage control | Mark E. Tuttle | 2023-02-14 |
| 11574820 | Semiconductor devices with flexible reinforcement structure | Owen R. Fay | 2023-02-07 |
| 11557526 | Substrates for semiconductor device assemblies and systems with improved thermal performance and methods for making the same | Hyunsuk Chun, Xiaopeng Qu | 2023-01-17 |