Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784166 | Dual sided fan-out package having low warpage across all temperatures | Chan H. Yoo | 2023-10-10 |
| 11756844 | Semiconductor device with a protection mechanism and associated systems, devices, and methods | Wei Zhou, Bret K. Street | 2023-09-12 |
| 11745281 | Solder removal from semiconductor devices | — | 2023-09-05 |
| 11581231 | Stress tuned stiffeners for micro electronics package warpage control | Chan H. Yoo | 2023-02-14 |
| 11564331 | Electronic device with a card-level thermal regulator mechanism and associated systems, devices, and methods | — | 2023-01-24 |