Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817397 | Semiconductor device package | Lu-Ming Lai, Hui-Chung Liu, Yu-Che Huang | 2023-11-14 |
| 11588470 | Semiconductor package structure and method of manufacturing the same | Lu-Ming Lai, Ching-Han Huang, Kuo-Hua LAI, Hui-Chung Liu | 2023-02-21 |