Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817397 | Semiconductor device package | Chi-Sheng Tseng, Lu-Ming Lai, Hui-Chung Liu | 2023-11-14 |
| 11562969 | Semiconductor device package including reinforced structure | Lu-Ming Lai | 2023-01-24 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817397 | Semiconductor device package | Chi-Sheng Tseng, Lu-Ming Lai, Hui-Chung Liu | 2023-11-14 |
| 11562969 | Semiconductor device package including reinforced structure | Lu-Ming Lai | 2023-01-24 |