Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817397 | Semiconductor device package | Chi-Sheng Tseng, Lu-Ming Lai, Yu-Che Huang | 2023-11-14 |
| 11588470 | Semiconductor package structure and method of manufacturing the same | Chi-Sheng Tseng, Lu-Ming Lai, Ching-Han Huang, Kuo-Hua LAI | 2023-02-21 |