Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11588470 | Semiconductor package structure and method of manufacturing the same | Chi-Sheng Tseng, Lu-Ming Lai, Ching-Han Huang, Hui-Chung Liu | 2023-02-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11588470 | Semiconductor package structure and method of manufacturing the same | Chi-Sheng Tseng, Lu-Ming Lai, Ching-Han Huang, Hui-Chung Liu | 2023-02-21 |