Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11588470 | Semiconductor package structure and method of manufacturing the same | Chi-Sheng Tseng, Lu-Ming Lai, Kuo-Hua LAI, Hui-Chung Liu | 2023-02-21 |
| 11565934 | Semiconductor package structures and methods of manufacturing the same | Yu-Hsuan Tsai, Lu-Ming Lai, Chien-Wei Fang | 2023-01-31 |