Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11721554 | Stress compensation for wafer to wafer bonding | Anant H. JAHAGIRDAR, Aaron D. Lilak, Myra McDonnell, Brennen Mueller, Mauro J. Kobrinsky | 2023-08-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11721554 | Stress compensation for wafer to wafer bonding | Anant H. JAHAGIRDAR, Aaron D. Lilak, Myra McDonnell, Brennen Mueller, Mauro J. Kobrinsky | 2023-08-08 |