Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855034 | Electronic device package and method of manufacturing the same | Chin-Li KAO, Chih-Yi Huang, Teck-Chong Lee | 2023-12-26 |
| 11798907 | Semiconductor packages | Yung-Sheng Lin, Yun-Ching HUNG, An-Hsuan HSU | 2023-10-24 |
| 11621217 | Substrate structure and semiconductor package structure | Chun-Wei Shih, Sheng-Wen Yang, Chin-Li KAO | 2023-04-04 |