Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11621217 | Substrate structure and semiconductor package structure | Chun-Wei Shih, Chung-Hung LAI, Chin-Li KAO | 2023-04-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11621217 | Substrate structure and semiconductor package structure | Chun-Wei Shih, Chung-Hung LAI, Chin-Li KAO | 2023-04-04 |