Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11621217 | Substrate structure and semiconductor package structure | Sheng-Wen Yang, Chung-Hung LAI, Chin-Li KAO | 2023-04-04 |
| 11598766 | Chemical sensor | Ching-Tung Hsu, Chao-Chieh Lin, Yuan-Shin Huang, Chia-Hung Li, Chun-Hsien Tsai +1 more | 2023-03-07 |