Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855034 | Electronic device package and method of manufacturing the same | Chung-Hung LAI, Chih-Yi Huang, Teck-Chong Lee | 2023-12-26 |
| 11621217 | Substrate structure and semiconductor package structure | Chun-Wei Shih, Sheng-Wen Yang, Chung-Hung LAI | 2023-04-04 |