Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855061 | Offset-aligned three-dimensional integrated circuit | Milind S. Bhagavat, Rahul Agarwal, Dmitri Yudanov | 2023-12-26 |
| 11804479 | Scheme for enabling die reuse in 3D stacked products | John Wuu, Milind S. Bhagavat, Rahul Agarwal | 2023-10-31 |
| 11742301 | Fan-out package with reinforcing rivets | Rahul Agarwal, Milind S. Bhagavat, Priyal Shah, Chia-Hao Cheng, Lei Fu | 2023-08-29 |
| 11709327 | Fanout module integrating a photonic integrated circuit | Raja Swaminathan, Kong-Toon Ng, Rahul Agarwal | 2023-07-25 |
| 11676940 | Hybrid bonded interconnect bridging | Lei Fu, Rahul Agarwal | 2023-06-13 |