Issued Patents 2023
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855061 | Offset-aligned three-dimensional integrated circuit | Brett P. Wilkerson, Rahul Agarwal, Dmitri Yudanov | 2023-12-26 |
| 11841803 | GPU chiplets using high bandwidth crosslinks | Skyler Jonathon Saleh, Samuel D. Naffziger, Rahul Agarwal | 2023-12-12 |
| 11837588 | Circuit board with compact passive component arrangement | Rahul Agarwal | 2023-12-05 |
| 11810891 | Bond pads for low temperature hybrid bonding | Priyal Shah | 2023-11-07 |
| 11804479 | Scheme for enabling die reuse in 3D stacked products | John Wuu, Brett P. Wilkerson, Rahul Agarwal | 2023-10-31 |
| 11742301 | Fan-out package with reinforcing rivets | Rahul Agarwal, Priyal Shah, Chia-Hao Cheng, Brett P. Wilkerson, Lei Fu | 2023-08-29 |
| 11715691 | Integrated circuit package with integrated voltage regulator | Rahul Agarwal, Chia-Hao Cheng | 2023-08-01 |
| 11676924 | Semiconductor chip with reduced pitch conductive pillars | Priyal Shah, Lei Fu | 2023-06-13 |
| 11670624 | Integrated circuit module with integrated discrete devices | Rahul Agarwal | 2023-06-06 |
| 11658123 | Hybrid bridged fanout chiplet connectivity | Rahul Agarwal | 2023-05-23 |