Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11828902 | Multi-scale three-dimensional (3D) engineering geological model construction system and method | Bowen Zheng, Shengwen Qi, Zhendong Cui, Rixiang Zhu, Bo Wan +12 more | 2023-11-28 |
| 11742301 | Fan-out package with reinforcing rivets | Rahul Agarwal, Milind S. Bhagavat, Priyal Shah, Chia-Hao Cheng, Brett P. Wilkerson | 2023-08-29 |
| 11676924 | Semiconductor chip with reduced pitch conductive pillars | Priyal Shah, Milind S. Bhagavat | 2023-06-13 |
| 11676940 | Hybrid bonded interconnect bridging | Brett P. Wilkerson, Rahul Agarwal | 2023-06-13 |