Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810891 | Bond pads for low temperature hybrid bonding | Milind S. Bhagavat | 2023-11-07 |
| 11742301 | Fan-out package with reinforcing rivets | Rahul Agarwal, Milind S. Bhagavat, Chia-Hao Cheng, Brett P. Wilkerson, Lei Fu | 2023-08-29 |
| 11676924 | Semiconductor chip with reduced pitch conductive pillars | Milind S. Bhagavat, Lei Fu | 2023-06-13 |