Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11626351 | Semiconductor package with barrier to contain thermal interface material | Ivan Nikitin, Timo Bohnenberger, Martin Mayer, Alexander Roth, Franz Zollner | 2023-04-11 |
| 11598904 | Power semiconductor module and method for producing a power semiconductor module | Ivan Nikitin, Dirk Ahlers, Andre Uhlemann | 2023-03-07 |
| 11574889 | Power module comprising two substrates and method of manufacturing the same | Ottmar Geitner, Wolfram Hable, Frank Winter, Christian Neugirg, Ivan Nikitin | 2023-02-07 |