Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848281 | Die stack with reduced warpage | Bin Liu, Zhicheng Ding, Aiping Tan | 2023-12-19 |
| 11830848 | Electronic device package | Zhicheng Ding, Bin Liu, Hyoung Il Kim | 2023-11-28 |
| 11742284 | Interconnect structure fabricated using lithographic and deposition processes | Zhicheng Ding, Bin Liu, Zhijun Xu | 2023-08-29 |