Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830848 | Electronic device package | Zhicheng Ding, Bin Liu, Yong She | 2023-11-28 |
| 11817438 | System in package with interconnected modules | Bilal Khalaf, Juan E. Dominguez, John G. Meyers | 2023-11-14 |
| 11749653 | Multi-die, vertical-wire package-in-package apparatus, and methods of making same | Florence R. Pon, Yi Xu | 2023-09-05 |
| 11694987 | Active package substrate having anisotropic conductive layer | Juan E. Dominguez | 2023-07-04 |
| 11658079 | Temporary interconnect for use in testing a semiconductor package | Yi Xu, Florence R. Pon | 2023-05-23 |
| 11637045 | Anisotropic conductive film (ACF) for use in testing semiconductor packages | — | 2023-04-25 |
| 11545464 | Diode for use in testing semiconductor packages | Yi Xu, Florence R. Pon | 2023-01-03 |